Highlights
Intel® Optane™ Memory Supported Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Intel® Turbo Boost Technology Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t. Intel® vPro™ Platform Eligibility Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations. Intel® Virtualization Technology (VT-x) Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions. Intel® Virtualization Technology for Directed I/O (VT-d) Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments. Intel® VT-x with Extended Page Tables (EPT) Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management. Intel® TSX-NI Intel® Transactional Synchronization Extensions New Instructions (Intel® TSX-NI) are a set of instructions focused on multi-threaded performance scaling. This technology helps make parallel operations more efficient via improved control of locks in software. Intel® 64 Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory. Instruction Set An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with. Instruction Set Extensions Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions). Idle States Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states. Enhanced Intel SpeedStep® Technology Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery. Thermal Monitoring Technologies Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.Specifications
- Processor family Intel® Xeon®
- Processor cores 4
- Processor socket LGA 1151 (Socket H4)
- Processor lithography 14 nm
- Box Y
- Cooler included Y
- Processor manufacturer Intel
- Processor model E-2124G
- Processor base frequency 3.4 GHz
- Processor operating modes 64-bit
- Component for Server/workstation
- Processor threads 4
- System bus rate 8 GT/s
- Processor boost frequency 4.5 GHz
- Processor cache 8 MB
- Processor cache type Smart Cache
- Thermal Design Power (TDP) 71 W
- Bus type DMI3
- Memory bandwidth supported by processor (max) 41.6 GB/s
- Processor codename Coffee Lake
- Processor ARK ID 134854
- Memory channels Dual-channel
- Maximum internal memory supported by processor 128 GB
- Memory types supported by processor DDR4-SDRAM
- Memory clock speeds supported by processor 2666 MHz
- ECC Y
- On-board graphics card Y
- Discrete graphics card N
- On-board graphics card model Intel UHD Graphics P630
- Discrete graphics card model Not available
- Maximum on-board graphics card memory 128 GB
- On-board graphics card outputs supported Embedded DisplayPort (eDP), DisplayPort, HDMI, DVI
- On-board graphics card base frequency 350 MHz
- On-board graphics card dynamic frequency (max) 1150 MHz
- Number of displays supported (on-board graphics) 3
- On-board graphics card 4K support Y
- On-board graphics card DirectX version 12.0
- On-board graphics card OpenGL version 4.5
- On-board graphics card maximum resolution (DisplayPort) 4096 x 2304 pixels
- On-board graphics card maximum resolution (eDP - Integrated Flat Panel) 4096 x 2304 pixels
- On-board graphics card maximum resolution (HDMI) 4096 x 2160 pixels
- On-board graphics card refresh rate at maximum resolution (DisplayPort) 60 Hz
- On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) 60 Hz
- On-board graphics card refresh rate at maximum resolution (HDMI) 24 Hz
- On-board graphics card ID 0x3E96
- Execute Disable Bit Y
- Idle States Y
- Thermal Monitoring Technologies Y
- Market segment Server
- Maximum number of PCI Express lanes 16
- PCI Express slots version 3.0
- PCI Express configurations 1x16, 2x8, 1x8+2x4
- Supported instruction sets SSE4.1, SSE4.2, AVX 2.0
- Scalability 1S
- CPU configuration (max) 1
- Embedded options available Y
- PCI Express CEM revision 3.0
- Harmonized System (HS) code 85423119
- Export Control Classification Number (ECCN) 5A992C
- Commodity Classification Automated Tracking System (CCATS) G077159
- Intel® Hyper Threading Technology (Intel® HT Technology) N
- Intel® Turbo Boost Technology 2.0
- Intel® Quick Sync Video Technology Y
- Intel® InTru™ 3D Technology Y
- Intel® Clear Video HD Technology (Intel® CVT HD) Y
- Intel® AES New Instructions (Intel® AES-NI) Y
- Enhanced Intel SpeedStep Technology Y
- Intel Trusted Execution Technology Y
- Intel® Memory Protection Extensions (Intel® MPX) Y
- Intel® Turbo Boost Technology 2.0 frequency 4.5 GHz
- Intel® Transactional Synchronization Extensions Y
- Intel Enhanced Halt State Y
- Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) Y
- Intel VT-x with Extended Page Tables (EPT) Y
- Intel® Secure Key Y
- Intel TSX-NI Y
- Intel® OS Guard Y
- Intel Clear Video Technology Y
- Intel Software Guard Extensions (Intel SGX) Y
- Intel 64 Y
- Intel Secure Key Technology version 1.00
- Intel Virtualization Technology (VT-x) Y
- Intel Virtualization Technology for Directed I/O (VT-d) Y
- Intel TSX-NI version 1.00
- Intel® Optane™ Memory Ready Y
- Intel® Boot Guard Y
- Intel® vPro™ Platform Eligibility Y
- Tjunction 100 °C
- Processor cache 8192 KB
- Product type Processor
- Supported memory types DDR4-SDRAM
- Maximum graphics card memory 128 GB
- Package type Retail box
- Processor package size 37.5 x 37.5 mm
- Maximum internal memory 128 GB
- Maximum internal memory 131072 MB
- Video decoding Y
- Bus bandwidth 8
- Bus type units GT/s
- Launch date Q3'18
- Maximum resolution & refresh rate (DisplayPort) 4096x2304@60Hz
- Maximum resolution & refresh rate (HDMI) 4096x2160@24Hz
- Maximum resolution & refresh rate (Integrated Flat Panel) 4096x2304@60Hz
- Maximum resolution & refresh rate (VGA) N/A
- Status Launched
- Maximum memory 128 GB
- Processor brand name Intel Xeon
- Last change 63903513
- Product family Intel Xeon Processors
- Bus speed 8 GT/s
- Processor ID 0x3E96
- Graphics output eDP/DP/HDMI/DVI
- Product family Xeon
