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GIGABYTE AORUS NVMe Gen4 1 TB M.2 PCI Express 4.0 3D TLC

SKU
GP-ASM2NE6100TTTD
Out of stock
AORUS NVMe Gen4 SSD, 1 TB, Rose Gold/Black

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Overview
Full specs

Overview

Highlights

World First PCIe 4.0x4 Controller
The World First PCIe 4.0x4 Controller, Phison PS5016-E16 controller, made by 28nm manufacturing technology. The advanced fabrication process ensures PS5016-E16 has enough compute power for ECC processing when adopting the latest 3D TLC NAND flash. PS5016-E16 also features eight NAND channels with 32 CE targets, DDR4 DRAM caching, and a PCIe 4.0x4 interface. As for features, the chip supports the NVMe 1.3 protocol, LDPC error correction, and Wear Leveling, Over-Provision technologies to improve reliability and durability of SSDs.

NAND Flash Selected for High Quality and Performance
TOSHIBA BiCS4 96 Layers 3D TLC (800MT/s)
Toshiba BiCS4 NAND Flash optimizes circuitry and architecture by increasing to 96 layers for higher storage space per unit area. 800MT/s throughput on the AORUS NVMe Gen 4 SSD far exceeds that of PCIe 3.0x4 devices for superior storage performance.

Xtreme Storage Performance
With the new PCIe 4.0 controller, AORUS NVMe Gen 4 SSD delivers blazing speeds: up to 5,000 MB/s for sequential read, and up to 4,400MB/s sequential write. Sequential Read performance of PCIe 4.0 SSDs is up to 40% faster than PCIe 3.0 SSDs. Get ready to enter the next generation of computing with faster and smoother, gaming, streaming, and graphics intensive rendering.

Full Body Copper Thermal Solution for Outstanding PCIe 4.0 SSD Performance
The Full Body Copper Heatsink takes into account the heat transfer from key components on both the front and back of the device, the controller and NAND Flash. Full copper heatsinks have 69% higher heat transfer capacity compared to aluminum heatsinks giving AORUS NVMe Gen4 SSD the best heat dissipation for read/write performance.

Efficient Copper Heat Spreader Design
Compared with a plated M.2 heat spreader, new efficient copper heat spreaders with 27 fins add more surface area which improve thermal transfer from heating sources to obtain thermal balance sooner. Moreover, Optimized fin array design does great heat exchange with any direction of air flow. Both unique design make sure key components of PCIe 4.0 SSD to keep suitable working temperature under ultra high transfer rate.

Why is keeping an SSDs at lower temperatures so important?
- Higher working temperature may cause data loss. The degradation factor of data loss could be a hundred times higher.
- With Full Body Copper Heat Spreaders, the AORUS NVMe Gen 4 SSD can operate at lower working temperatures to improve data storage reliability. Furthermore, SSDs can deliver extreme performance for longer periods.

SSD Tool Box
The newly updated SSD Tool Box is a software that gives users an overview of the SSD Status and various aspects such as model name, FW version, health condition and sensor temperature. Moreover, users can clear all the data with the Secure Erase function. You can download the SSD Tool Box from the link.

Good to know

Features

  • Active garbage collection
    No
  • Adaptive thermal protection
    No
  • Backlight
    No
  • Component for
    PC/Notebook
  • DevSlp (device sleep) support
    No

Operational conditions

  • Storage temperature (T-T)
    -40 - 85

Other features

  • Conflict-Free
    No
  • Internal
    No
  • LED light
    No
  • Operating temperature (T-T)
    0 - 70
  • Registered
    No

Logistics data

  • Harmonized System (HS) code
    84717070
  • Serialized
    No

Full Specs

    Operational conditions
    • Storage temperature (T-T)
      -40 - 85
    Supplier features
    • Product or Article Information Sheet available?
      No
    Sustainability
    • Sustainability compliance
      No
    Logistics data
    • Harmonized System (HS) code
      84717070
    • Serialized
      No
    Power
    • Power consumption (read)
      6.500000
    • Power consumption (write)
      6.600000
    Brand-specific features
    • Intel High Endurance Technology (HET)
      No
    • Intel Stable Image Platform Program (SIPP)
      No
    • Intel® Optane™
      No
    • Intel® Rapid Start Technology
      No
    • Intel® Remote Secure Erase
      No
    • Intel® Smart Response Technology
      No
    Other features
    • Conflict-Free
      No
    • Internal
      No
    • LED light
      No
    • Operating temperature (T-T)
      0 - 70
    • Registered
      No
    • USB powered
      No
    • Wi-Fi
      No
    Packaging data
    • Manual
      No
    • Package type
      Box
    • Quick start guide
      No
    • Screws included
      No
    • Storage drive adapter included
      No
    • Storage drive external enclosure
      No
    • Storage drive spacer included
      No
    Features
    • Active garbage collection
      No
    • Adaptive thermal protection
      No
    • Backlight
      No
    • Component for
      PC/Notebook
    • DevSlp (device sleep) support
      No
    • Dynamic Write Acceleration (DWA)
      No
    • ECC
      No
    • End-to-End Data Protection
      No
    • Enhanced Power Loss Data Protection technology
      No
    • Exclusive data defense
      No
    • External DDR cache
      No
    • H/W PLP function
      No
    • Hardware encryption
      No
    • Hot-Plug support
      No
    • Hot-swap
      No
    • IEEE 1667
      No
    • Instant Secure Erase (ISE)
      No
    • JEDEC standard
      No
    • Low-density parity-check (LDPC)
      No
    • Mean time between failures (MTBF)
      1770000.000000
    • Multistep data integrity algorithm
      No
    • NVMe
      No
    • NVMe version
      1.3
    • Native Command Queuing (NCQ)
      No
    • Opal SSC 2.0
      No
    • Password protection
      No
    • Power Failure Management Plus (PFM+)
      No
    • Power loss protection
      No
    • RAID support
      No
    • Random read (4KB)
      750000.000000
    • Random write (4KB)
      700000.000000
    • Read speed
      5000.000000
    • S.M.A.R.T. support
      No
    • SSD capacity
      1000.000000
    • SSD form factor
      M.2
    • SSD temperature monitoring
      No
    • Self-Encrypting Drive (SED)
      No
    • TCG Opal 2.0
      No
    • TRIM support
      No
    • Temperature monitoring and logging
      No
    • Write speed
      4400.000000

More Information

Specifications

  • Manual
    No
  • Package type
    Box
  • S.M.A.R.T. support
    No
  • TRIM support
    No
  • Component for
    PC/Notebook
  • SSD form factor
    M.2
  • NVMe
    No
  • NVMe version
    1.3
  • Storage temperature (T-T)
    -40 - 85
  • Operating temperature (T-T)
    0 - 70
  • Harmonized System (HS) code
    84717070
  • Mean time between failures (MTBF)
    1770000
  • Read speed
    5000
  • Write speed
    4400
  • SSD capacity
    1000
  • Power consumption (read)
    6.5
  • Power consumption (write)
    6.6
  • Random write (4KB)
    700000
  • Random read (4KB)
    750000

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